ECE 418/518:  Semiconductor Processing, Spring 2006


HOME

SYLLABUS

PROJECT

(out May 1, 2006)

LAB GUIDE

(coming by week 5)

GRADES


                                                                                   

Welcome to the ECE 418/518 Semiconductor Processing web site. This site contains information and downloadable materials for the class and laboratory that you will need during the course.

Instructor:  Thomas K. (Tom) Plant [tkp], Office:  KEC 3123;  Phone: 737-2984;  E-mail: tkp@eecs.orst.edu,            Office Hours:  MW 8-9, MWF 3-4 or by e-mail appointment

Class TAs:   Eric Sundholm:                Office:              E-mail:  sundholm@eecs.oregonstate.edu          Office Hours:  E-mail to set up appointment and TBA

                     Linda Englebrecht:           Office:              E-mail:  lemums@yahoo.com                            Office Hours:  E-mail to set up appointment and TBA

 

Class Meeting Times:           MWF 10-1050,     Location:   Covell 218             (First 5 weeks)

                                                F 10-1050 only for last 5 weeks – also in Covell 218

 

Textbook:     Introduction to Microelectronics Fabrication, 2nd Edn.

      Purdue Modular Series on Solid State Devices, vol. V

      Author: Richard Jaeger (Prentice-Hall Publishing, 2002)

 

Labs:   MW  9-11; 10-12; 11-1                      [All labs meet in Owen 433 clean room.    4 students / 2-hr lab section.]

            TuTh 1-3; 2-4; 3-5

 

 

Lab Assignments:
Lab 1 –  Fabricate and measure MOS capacitors   (Weeks 6 and 7a)

Lab 2   Fabricate and measure a PN diode, a linear resistor, and 3 sizes of NMOS transistors.   Also measure contact resistance   (Weeks 7b -10)
          

 

Reading Assignments:
Week 1    Chapters 1 and 3 – Fabrication overview and oxidation                                                                                 Overview:         Oxidation

Week 2    Chapter 2 and SUPREM tutorial – Photolithography, oxide etch, and process modeling                                 Crystal Growth Lithography
Week 3    Chapters 4 and 5 – Diffusion and ion implantation                                                                                         Diffusion           Implantation
Week 4    Chapters 6 (7 and 8 lightly) – Thin-film deposition, interconnects, and packaging                                           Deposition
Week 5    Chapter 9 – MOS process integration                                                                                                           Process Integration


Week 6    Lab #1:  MOS capacitor – oxidation;  metallization
Week 7    Lab #1:  measure;  Lab #2 NMOS transistors – field oxide

Week 8    Lab #2:   photolithography (PL) and n-diffusion window etch; P (n-type) diffusion                                                                    
Week 9    Lab #2:  PL, contact window etch, Al contact evaporation; PL and Al contact etch to complete wafer fab

Week 10  Lab #2:  Measure contact resistance, PN junction, resistor;  measure 3 NMOS transistors and compare           

 

 

Homework Assignments:
Homework Assignment #1:  Ch 1: 14,15; Ch 2: 1,3,4; Ch 3: 7,8,17                  Due:  Friday, April 21, 2006                 Homework #1 Solutions
Homework Assignment #2:  Ch 4: 1,2,10; Ch 5: 1; Ch 6: 3,9                            Due:  Friday, May 5, 2006                   Homework #2 Solutions

SUPREM Project (May 1, 2006)                     Due June 9, 2006

 

 

Useful links for class materials

Stanford University Processing Lab

 

Some Semiconductor Companies in Oregon & Washington:

http://www.hp.com/

http://www.hynixeugene.com/

http://www.idt.com/

http://www.intel.com/

http://www.lsilogic.com/

http://www.maxim-ic.com/

http://www.sehamerica.com/

http://www.siltronic.com/

http://www.sumcousa.com/

http://www.triquint.com/

http://www.wafertech.com/index.htm

 

Page last modified by T.K. Plant:
June 29, 2006